Specifications
| Status |
Mass Production (Preferred) |
| Capacitance |
100 uF ± 20 % |
| Case Size (EIA/JIS) |
0805/2012 |
| Rated Voltage |
4 V |
| tanδ (max) |
20 % |
| Temperature Characteristic (EIA) |
X6S |
| Operating Temp. Range (EIA) |
-55 to +105 ℃ |
| Capacitance Change(EIA) |
±22 % |
High Temperature Loading
(% Rated Voltage) |
100 % |
| Insulation Resistance (min) |
100 MΩ・µF |
| Dimension L |
2.0 +0.20/-0.00 mm |
| Dimension W |
1.25 +0.20/-0.00 mm |
| Dimension T |
1.25 +0.20/-0.00 mm |
| Dimension e |
0.50 ±0.25 mm |
| RoHS Compliance (10 subst.) |
Yes |
| REACH Compliance (240 subst.) |
Yes |
| IEC62474 (Ver. D28.00) Compliance |
Yes |
| Halogen Free |
Yes |
| Soldering |
Reflow |
| Standard Quantity |
Taping Embossed 3000pcs |
|
Appearance
|
Features
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
The use of nickel as electrode material and plating processing improve the solderability
and heat resistance characteristics. It also prevents migration and raises the level
of reliability.
Low equivalent series resistance(ESR) provides superior noise absorption characteristics
*Please check the individual product specification sheets for details.
|
Main Applications
Mobile Devices
Mobile Phone
Smartphone, etc.
|
|
Document
|
Simulation data
|
Links
|
RoHS and REACH Certificate of Compliance
|
Characteristic value graphs
|
Sn-Zn solder paste can affect MLCC reliability performance.
Please contact Taiyo Yuden Co., Ltd prior to usage.
Please contact our sales staff when ordering or inquiring the details about products on our website.
|
