製品仕様
| Status |
Non-preferred |
| Capacitance |
3.4 pF ± 0.25pF |
| Case Size (EIA/JIS) |
0201/0603 |
| Rated Voltage |
50 V |
| Q (min) |
468 at 1MHz |
| Temperature Characteristic (EIA) |
C0G |
| Operating Temp. Range (EIA) |
-55 to +125 ℃ |
| Temperature Characteristic (JIS) |
CG |
| Operating Temp. Range (JIS) |
-55 to +125 ℃ |
| Temperature coefficient |
0 ±30 ppm/℃ |
High Temperature Loading
(% Rated Voltage) |
200 % |
| Insulation Resistance (min) |
10 GΩ |
| Derating |
STD |
| Dimension L |
0.6 ±0.03 mm |
| Dimension W |
0.3 ±0.03 mm |
| Dimension T |
0.3 ±0.03 mm |
| Dimension e |
0.15 ±0.05 mm |
| RoHS Compliance (10 subst.) |
Yes |
| REACH Compliance (251 subst.) |
Yes |
| Halogen Free |
Yes |
| Soldering |
Reflow |
| Standard Quantity |
Taping Paper 15000pcs |
在庫
旧品番 :
| 販売店 |
在庫 |
購入 |
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外観
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特徴
Improved higher density mounting
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
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主な用途
General electronic equipment
Communication equipment
(cellular phone, wireless applications, etc.)
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製品資料
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シミュレーションデータ
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リンク
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製品環境証明書
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Sn-Zn solder paste can affect MLCC reliability performance.
Please contact Taiyo Yuden Co., Ltd prior to usage.
Please contact our sales staff when ordering or inquiring the details about products on our website.
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特性値グラフ
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