CERAMIC RF DEVICES
[Ceramic RF Devices (Diplexers)]
| Status | Mass Production (Preferred) |
|---|---|
| System | LTE/5G/Bluetooth/Wi-Fi |
| Frequency1 | Low band |
| Passband Frequency1 (f1) | 2400 to 2500 MHz |
| Insertion Loss1 (max)(in f1) | 1 dB at 2400 to 2500MHz (+25 ℃) |
| Insertion Loss2 (max)(in f1) | 1.1 dB at 2400 to 2500MHz (-40 to +85 ℃) |
| VSWR1 (max)(in f1) | 2 at 2400 to 2500MHz |
| Attenuation1 (min)(f1) | 13 dB 3300 to 3700MHz |
| Attenuation2 (min)(f1) | 25 dB 3800 to 5925MHz |
| Frequency2 | High band |
| Passband Frequency2 (f2) | 5150 to 7125 MHz |
| Insertion Loss1 (max)(in f2) | 1.55 dB at 5150 to 7125MHz (+25 ℃) |
| Insertion Loss2 (max)(in f2) | 1.65 dB at 5150 to 7125MHz (-40 to +85 ℃) |
| VSWR1 (max)(in f2) | 2.1 at 5150 to 7125MHz |
| Attenuation1 (min)(f2) | 25 dB at 617 to 2690MHz |
| Attenuation2 (min)(f2) | 15 dB at 3300 to 4200MHz |
| Input Impedance / Output Impedance | 50 Ω / 50 Ω |
| Dimension L | 1.6 ±0.10 mm |
| Dimension W | 0.8 ±0.10 mm |
| Dimension T | Max 0.65 mm |
| Operating Temp. Range | -40 to +85 ℃ |
| RoHS Compliance (10 subst.) | Yes |
| REACH Compliance (251 subst.) | Yes |
| Halogen Free | Yes |
| Soldering | Reflow |
| Standard Quantity | Taping Papered 5000pcs |