供应体制 |
量产(非推荐) |
静电容量 |
4.7 uF ± 20 % |
额定电压 |
63 V |
tanδ (max) |
0.08 |
使用温度范围 |
-55 to +105 ℃ |
Leakage current (min) |
3 uA at 2 min |
Rated Ripple (max) |
50 mArms at 100k Hz / 105 ℃ |
Impedance ratio ___[-25℃/+20℃] |
2 |
Impedance ratio ___[-40℃/+20℃] |
3 |
Impedance ratio ___[-55℃/+20℃] |
3 |
ESR (max) |
3 Ω at 100k Hz / 20 ℃ |
Endurance ___[Test time] |
2000 hr at 105 ℃ |
Endurance ___[Capacitance change] |
Within ±30% of initial value |
Endurance ___[tanδchange] |
200% or less of initial specified value |
尺寸 (φD) |
φ0.197 ±0.020 inch |
尺寸 (L) |
0.228 ±0.012 inch |
尺寸 (P (F)) |
Typ 0.059 inch |
尺寸 (C (d)) |
Typ 0.091 inch |
形状 |
Vertical Chip (SMD) |
类别 |
Low ESR |
RoHS Compliance (10 subst.) |
Yes |
REACH Compliance (242 subst.) |
Yes |
适用焊接 方法 |
Reflow |
LeadForming/Taping |
Taping Embossed |
包装 |
1000 |