| 供应体制 |
量产(推荐) |
| 静电容量 |
330 uF ± 20 % |
| 额定电压 |
50 V |
| tanδ (max) |
0.1 |
| 使用温度范围 |
-55 to +125 ℃ |
| Leakage current (min) |
165 uA at 2 min |
| Rated Ripple (max) |
3500 mArms at 100k Hz / 125 ℃ |
Impedance ratio
___[-25℃/+20℃] |
1.5 |
Impedance ratio
___[-55℃/+20℃] |
2 |
| ESR (max) |
20 mΩ at 100k Hz / 20 ℃ |
Endurance
___[Test time] |
6000 hr at 125 ℃ |
Endurance
___[Capacitance change] |
Within ±30% of initial value |
Endurance
___[tanδchange] |
200% or less of initial specified value |
| 尺寸 (φD) |
φ12.5 ±0.5 mm |
| 尺寸 (L) |
13.5 ±0.5 mm |
| 尺寸 (P (F)) |
Typ 4.6 mm |
| 尺寸 (C (d)) |
Typ 4.9 mm |
| 形状 |
Vertical Chip
(SMD) |
| 类别 |
Conductive Polymer Hybrid |
| RoHS Compliance (10 subst.) |
Yes |
| REACH Compliance (242 subst.) |
Yes |
| 适用焊接 方法 |
Reflow |
| LeadForming/Taping |
Taping Embossed |
| 包装 |
200 |
