(旧型号 HTL-25V821MIEN-R5)
铝电解电容器
[车载 (车身系・情报系)用途 导电性高分子混合铝电解电容器[HTL]]
| 供应体制 | 量产(推荐) |
|---|---|
| 静电容量 | 820 uF ± 20 % |
| 额定电压 | 25 V |
| tanδ (max) | 0.14 |
| 使用温度范围 | -55 to +125 ℃ |
| Leakage current (min) | 205 uA at 2 min |
| Rated Ripple (max) | 3500 mArms at 100k Hz / 125 ℃ |
| Impedance ratio ___[-25℃/+20℃] |
1.5 |
| Impedance ratio ___[-55℃/+20℃] |
2 |
| ESR (max) | 15 mΩ at 100k Hz / 20 ℃ |
| Endurance ___[Test time] |
8000 hr at 125 ℃ |
| Endurance ___[Capacitance change] |
Within ±30% of initial value |
| Endurance ___[tanδchange] |
200% or less of initial specified value |
| 尺寸 (φD) | φ12.5 ±0.5 mm |
| 尺寸 (L) | 13.5 ±0.5 mm |
| 尺寸 (P (F)) | Typ 4.6 mm |
| 尺寸 (C (d)) | Typ 4.9 mm |
| 形状 | Vertical Chip for Vibration (SMD) |
| 类别 | Conductive Polymer Hybrid |
| RoHS Compliance (10 subst.) | Yes |
| REACH Compliance (240 subst.) | Yes |
| 适用焊接 方法 | Reflow |
| LeadForming/Taping | Taping Embossed |
| 包装 | 200 |