製品仕様
| Status |
Mass Production (Preferred) |
| Capacitance |
0.22 uF ± 20 % |
| Case Size (EIA/JIS) |
01005/0402 |
| Rated Voltage |
4 V |
| tanδ (max) |
10 % |
| Temperature Characteristic (EIA) |
X5R |
| Operating Temp. Range (EIA) |
-55 to +85 ℃ |
| Capacitance Change(EIA) |
±15 % |
High Temperature Loading
(% Rated Voltage) |
150 % |
| Insulation Resistance (min) |
100 MΩ・µF |
| Derating |
Derating |
| Dimension L |
0.016 ±0.001 inch |
| Dimension W |
0.008 ±0.001 inch |
| Dimension T |
0.008 ±0.001 inch |
| Dimension e |
0.004 ±0.0012 inch |
| RoHS Compliance (10 subst.) |
Yes |
| REACH Compliance (251 subst.) |
Yes |
| Halogen Free |
Yes |
| Soldering |
Reflow |
| Standard Quantity |
Taping Embossed 40000pcs |
在庫
旧品番 :
| 販売店 |
在庫 |
購入 |
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外観
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特徴
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
The use of nickel as electrode material and plating processing improve the solderability
and heat resistance characteristics. It also prevents migration and raises the level
of reliability.
Low equivalent series resistance(ESR) provides superior noise absorption characteristics
*Please check the individual product specification sheets for details.
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主な用途
Mobile Devices
Mobile Phone
Smartphone, etc.
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製品資料
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シミュレーションデータ
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リンク
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製品環境証明書
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Sn-Zn solder paste can affect MLCC reliability performance.
Please contact Taiyo Yuden Co., Ltd prior to usage.
Please contact our sales staff when ordering or inquiring the details about products on our website.
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特性値グラフ
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