製品仕様
| Status |
Mass Production (Preferred) |
| Capacitance |
1.2 pF ± 0.1pF |
| Case Size (EIA/JIS) |
008004/0201 |
| Rated Voltage |
25 V |
| Q (min) |
424 at 1MHz |
| Temperature Characteristic (EIA) |
C0G |
| Operating Temp. Range (EIA) |
-55 to +125 ℃ |
| Temperature Characteristic (JIS) |
CG |
| Operating Temp. Range (JIS) |
-55 to +125 ℃ |
| Temperature coefficient |
0 ±30 ppm/℃ |
High Temperature Loading
(% Rated Voltage) |
200 % |
| Insulation Resistance (min) |
10 GΩ |
| Derating |
STD |
| Dimension L |
0.25 ±0.013 mm |
| Dimension W |
0.125 ±0.013 mm |
| Dimension T |
0.125 ±0.013 mm |
| Dimension e |
0.0675 ±0.0275 mm |
| RoHS Compliance (10 subst.) |
Yes |
| REACH Compliance (247 subst.) |
Yes |
| Halogen Free |
Yes |
| Soldering |
Reflow |
| Standard Quantity |
Taping Embossed 50000pcs |
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外観
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高性能提案
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特徴
Improved higher density mounting
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
|
主な用途
General electronic equipment
Communication equipment
(cellular phone, wireless applications, etc.)
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製品資料
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シミュレーションデータ
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リンク
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製品環境証明書
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特性値グラフ
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Sn-Zn solder paste can affect MLCC reliability performance.
Please contact Taiyo Yuden Co., Ltd prior to usage.
Please contact our sales staff when ordering or inquiring the details about products on our website.
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