(Previous Part Number FI168B0845D9-T)
CERAMIC RF DEVICES
[Ceramic RF Devices (Band Pass Type)]
| Status | Mass Production (Preferred) |
|---|---|
| System | LTE-M/NB-IOT |
| Passband Frequency1 (f1) | 729 to 960 MHz |
| Insertion Loss1 (max)(in f1) | 1.9 dB at 729 to 960MHz (+25 ℃) |
| Insertion Loss2 (max)(in f1) | 2 dB at 729 to 960MHz (-40 to +85 ℃) |
| VSWR1 (max)(in f1) | 2 at 729 to 960MHz |
| Attenuation1 (min)(f1) | 18 dB at 240 to 320MHz |
| Attenuation2 (min)(f1) | 17 dB at 360 to 480MHz |
| Attenuation3 (min)(f1) | 3 dB at 1094 to 1440MHz |
| Attenuation4 (min)(f1) | 15 dB at 1458 to 2185MHz |
| Attenuation5 (min)(f1) | 35 dB at 2185 to 2880MHz |
| Attenuation6 (min)(f1) | 15 dB at 2900 to 3645MHz |
| Attenuation7 (min)(f1) | 30 dB at 3645 to 4800MHz |
| Attenuation8 (min)(f1) | 25 dB at 4800 to 6720MHz |
| Input Impedance / Output Impedance | 50 Ω / 50 Ω |
| Dimension L | 1.6 ±0.10 mm |
| Dimension W | 0.8 ±0.10 mm |
| Dimension T | Max 0.65 mm |
| Operating Temp. Range | -40 to +85 ℃ |
| RoHS Compliance (10 subst.) | Yes |
| REACH Compliance (240 subst.) | Yes |
| IEC62474 (Ver. D28.00) Compliance | Yes |
| Halogen Free | Yes |
| Soldering | Reflow |
| Standard Quantity | Taping Paper 5000pcs |