(Previous Part Number FI252M0829H2-T)
CERAMIC RF DEVICES
[Ceramic RF Devices (Triplexers)for 5G]
| Status | Mass Production (Preferred) |
|---|---|
| System | LTE/5G |
| Frequency1 | Low band |
| Passband Frequency1 (f1) | 450 to 960 MHz |
| Insertion Loss2 (max)(in f1) | 1 dB at 450 to 960MHz (-40 to +85 ℃) |
| VSWR1 (max)(in f1) | 2 at 450 to 960MHz |
| Attenuation1 (min)(f1) | 18 dB at 1427 to 2690MHz |
| Attenuation2 (min)(f1) | 20 dB at 3300 to 5950MHz |
| Frequency2 | Mid band |
| Passband Frequency2 (f2) | 1427 to 2690 MHz |
| Insertion Loss2 (max)(in f2) | 1.2 dB at 1427 to 2690MHz (-40 to +85 ℃) |
| VSWR1 (max)(in f2) | 2 at 1427 to 2690 |
| Attenuation1 (min)(f2) | 18 dB at 450 to 960MHz |
| Attenuation2 (min)(f2) | 18dB at 3300 to 5950MHz |
| Frequency3 | High band |
| Passband Frequency3 (f3) | 3300 to 5950 MHz |
| Insertion Loss2 (max)(in f3) | 1.5 dB at 3300 to 5950MHz (-40 to +85 ℃) |
| VSWR1 (max)(in f3) | 2 at 3300 to 5950 |
| Attenuation1 (min)(f3) | 20 dB at 450 to 960MHz |
| Attenuation2 (min)(f3) | 20 dB at 1427 to 2690MHz |
| Input Impedance / Output Impedance | 50 Ω / 50 Ω |
| Dimension L | 2.5 ±0.10 mm |
| Dimension W | 2.0 ±0.10 mm |
| Dimension T | Max 0.65 mm |
| Operating Temp. Range | -40 to +85 ℃ |
| RoHS Compliance (10 subst.) | Yes |
| REACH Compliance (240 subst.) | Yes |
| IEC62474 (Ver. D28.00) Compliance | Yes |
| Halogen Free | Yes |
| Soldering | Reflow |
| Standard Quantity | Taping Embossed 3000pcs |