| 공급 체제 |
양산(비권장) |
| 정전용량 |
1000 uF ± 20 % |
| 정격전압 |
35 V |
| tanδ (max) |
0.12 |
| 사용온도범위 |
-55 to +105 ℃ |
| Leakage current (min) |
350 uA at 2 min |
| Rated Ripple (max) |
1620 mArms at 100k Hz / 105 ℃ |
Impedance ratio
___[-25℃/+20℃] |
2 |
Impedance ratio
___[-40℃/+20℃] |
3 |
Impedance ratio
___[-55℃/+20℃] |
3 |
| ESR (max) |
0.044 Ω at 100k Hz / 20 ℃ |
Endurance
___[Test time] |
5000 hr at 105 ℃ |
Endurance
___[Capacitance change] |
Within ±30% of initial value |
Endurance
___[tanδchange] |
300% or less of initial specified value |
| φD사이즈 |
φ16 ±0.5 mm |
| L사이즈 |
16.5 ±0.5 mm |
| P (F)사이즈 |
Typ 7.2 mm |
| C (d)사이즈 |
Typ 5.6 mm |
| 형상 |
Vertical Chip
for Vibration (SMD) |
| 종별 |
Low ESR |
| RoHS Compliance (10 subst.) |
Yes |
| REACH Compliance (240 subst.) |
Yes |
| 적용 납땜법 |
Reflow |
| LeadForming/Taping |
Taping Embossed |
| 포장 |
125 |
