| 공급 체제 |
양산(비권장) |
| 정전용량 |
22 uF ± 20 % |
| 정격전압 |
6.3 V |
| tanδ (max) |
0.26 |
| 사용온도범위 |
-55 to +105 ℃ |
| Leakage current (min) |
3 uA at 2 min |
| Rated Ripple (max) |
90 mArms at 100k Hz / 105 ℃ |
Impedance ratio
___[-25℃/+20℃] |
2 |
Impedance ratio
___[-40℃/+20℃] |
3 |
Impedance ratio
___[-55℃/+20℃] |
8 |
| ESR (max) |
1.35 Ω at 100k Hz / 20 ℃ |
Endurance
___[Test time] |
2000 hr at 105 ℃ |
Endurance
___[Capacitance change] |
Within ±30% of initial value |
Endurance
___[tanδchange] |
200% or less of initial specified value |
| φD사이즈 |
φ4 ±0.5 mm |
| L사이즈 |
5.8 ±0.3 mm |
| P (F)사이즈 |
Typ 1 mm |
| C (d)사이즈 |
Typ 2 mm |
| 형상 |
Vertical Chip
(SMD) |
| 종별 |
Low ESR |
| RoHS Compliance (10 subst.) |
Yes |
| REACH Compliance (240 subst.) |
Yes |
| 적용 납땜법 |
Reflow |
| LeadForming/Taping |
Taping Embossed |
| 포장 |
2000 |
