(Previous Part Number FI168L2200G9-T)
CERAMIC RF DEVICES
[Ceramic RF Devices (Low Pass Type)]
| Status | Mass Production (Preferred) |
|---|---|
| System | W-CDMA/CDMA/GSM/LTE /5G |
| Passband Frequency1 (f1) | 1700 to 2700 MHz |
| Insertion Loss1 (max)(in f1) | 0.5 dB at 1700 to 2170MHz (+25 ℃) |
| Insertion Loss2 (max)(in f1) | 0.55 dB at 1700 to 2170MHz (-40 to +90 ℃) |
| Insertion Loss3 (max)(in f1) | 0.65 dB at 2170 to 2500MHz (+25 ℃) |
| Insertion Loss4 (max)(in f1) | 0.75 dB at 2170 to 2500MHz (-40 to +90 ℃) |
| Insertion Loss5 (max)(in f1) | 0.9 dB at 2500 to 2700MHz (+25 ℃) |
| Insertion Loss6 (max)(in f1) | 1 dB at 2500 to 2700MHz (-40 to +90 ℃) |
| Attenuation1 (min)(f1) | 25 dB at 3400MHz |
| Attenuation2 (min)(f1) | 22 dB at 3400 to 5400MHz |
| Attenuation3 (min)(f1) | 20 dB at 5400 to 8100MHz |
| Return Loss1 (min)(in f1) | 10 dB at 1700 to 2700MHz |
| Input Impedance / Output Impedance | 50 Ω / 50 Ω |
| Dimension L | 1.6 ±0.10 mm |
| Dimension W | 0.8 ±0.10 mm |
| Dimension T | Max 0.65 mm |
| Operating Temp. Range | -40 to +90 ℃ |
| RoHS Compliance (10 subst.) | Yes |
| REACH Compliance (240 subst.) | Yes |
| IEC62474 (Ver. D28.00) Compliance | Yes |
| Halogen Free | Yes |
| Soldering | Reflow |
| Standard Quantity | Taping Paper 5000pcs |