TSL1N18D829MLV0FDT

(Previous Part Number FI168L0829FD-T)

CERAMIC RF DEVICES

[Ceramic RF Devices (Low Pass Type)]


Appearance

Specifications

Status Mass Production (Preferred)
System LTE
Passband Frequency1 (f1) 698 to 960 MHz
Insertion Loss1 (max)(in f1) 0.4 dB at 698 to 960MHz (+25 ℃)
Insertion Loss2 (max)(in f1) 0.45 dB at 698 to 960MHz (-40 to +85 ℃)
VSWR1 (max)(in f1) 2 at 698 to 960MHz
Attenuation1 (min)(f1) 15 dB at 1554 to 1610MHz
Attenuation2 (min)(f1) 21 dB at 1760 to 1830MHz
Passband Frequency2 (f2) 617 to 698 MHz
Insertion Loss1 (max)(in f2) 0.55 dB at 617 to 698MHz (+25 ℃)
Insertion Loss2 (max)(in f2) 0.6 dB at 617 to 698MHz (-40 to +85 ℃)
Input Impedance / Output Impedance 50 Ω / 50 Ω
Dimension L 1.6 ±0.10 mm
Dimension W 0.8 ±0.10 mm
Dimension T Max 0.65 mm
Operating Temp. Range -40 to +85 ℃
RoHS Compliance (10 subst.) Yes
REACH Compliance (240 subst.) Yes
IEC62474 (Ver. D28.00) Compliance Yes
Halogen Free Yes
Soldering Reflow
Standard Quantity Taping Paper 5000pcs
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Features

Compact and Low-profile

Low loss and high attenuation

Stable temperature characteristics

Document

Links

RoHS and REACH Certificate of Compliance

Characteristic value graphs

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