製品仕様
Status |
Mass Production |
Capacitance |
5.9 pF ± 0.5pF |
Case Size (EIA/JIS) |
0201/0603 |
Rated Voltage |
50 V |
Q (min) |
518 at 1MHz |
Temperature Characteristic (EIA) |
C0G |
Operating Temp. Range (EIA) |
-55 to +125 ℃ |
Temperature Characteristic (JIS) |
CG |
Operating Temp. Range (JIS) |
-55 to +125 ℃ |
Temperature coefficient |
0 ±30 ppm/℃ |
High Temperature Loading (% Rated Voltage) |
200 % |
Insulation Resistance (min) |
10 GΩ |
Derating |
STD |
Dimension L |
0.6 ±0.03 mm |
Dimension W |
0.3 ±0.03 mm |
Dimension T |
0.3 ±0.03 mm |
Dimension e |
0.15 ±0.05 mm |
RoHS Compliance (10 subst.) |
Yes |
REACH Compliance (247 subst.) |
Yes |
Halogen Free |
Yes |
Soldering |
Reflow |
Standard Quantity |
Taping Paper 15000pcs |
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外観
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高性能提案
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特徴
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
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主な用途
For Telecommunications Infrastructure and Industrial Equipment
Telecommunications Infrastructure Equipment (e.g., base stations)
Industrial Equipment (e.g., factory automations, industry robots)
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製品資料
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シミュレーションデータ
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リンク
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製品環境証明書
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特性値グラフ
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Sn-Zn solder paste can affect MLCC reliability performance. Please contact Taiyo Yuden Co., Ltd prior to usage.
Please contact our sales staff when ordering or inquiring the details about products on our website.
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