제품 사양
| Status |
Mass Production (Preferred) |
| Capacitance |
3.5 pF ± 0.25pF |
| Case Size (EIA/JIS) |
008004/0201 |
| Rated Voltage |
25 V |
| Q (min) |
470 at 1MHz |
| Temperature Characteristic (EIA) |
C0G |
| Operating Temp. Range (EIA) |
-55 to +125 ℃ |
| Temperature Characteristic (JIS) |
CG |
| Operating Temp. Range (JIS) |
-55 to +125 ℃ |
| Temperature coefficient |
0 ±30 ppm/℃ |
High Temperature Loading
(% Rated Voltage) |
200 % |
| Insulation Resistance (min) |
10 GΩ |
| Derating |
STD |
| Dimension L |
0.25 ±0.013 mm |
| Dimension W |
0.125 ±0.013 mm |
| Dimension T |
0.125 ±0.013 mm |
| Dimension e |
0.0675 ±0.0275 mm |
| RoHS Compliance (10 subst.) |
Yes |
| REACH Compliance (250 subst.) |
Yes |
| Halogen Free |
Yes |
| Soldering |
Reflow |
| Standard Quantity |
Taping Embossed 50000pcs |
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외관
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고성능제안
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특징
Improved higher density mounting
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
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주요 용도
General electronic equipment
Communication equipment
(cellular phone, wireless applications, etc.)
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제품 자료
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시뮬레이션 데이터
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링크
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제품환경증명서
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Sn-Zn solder paste can affect MLCC reliability performance.
Please contact Taiyo Yuden Co., Ltd prior to usage.
Please contact our sales staff when ordering or inquiring the details about products on our website.
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특성 값 그래프
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