产品规格
| Status |
Mass Production (Preferred) |
| Capacitance |
8.4 pF ± 0.25pF |
| Case Size (EIA/JIS) |
008004/0201 |
| Rated Voltage |
25 V |
| Q (min) |
568 at 1MHz |
| Temperature Characteristic (EIA) |
C0G |
| Operating Temp. Range (EIA) |
-55 to +125 ℃ |
| Temperature Characteristic (JIS) |
CG |
| Operating Temp. Range (JIS) |
-55 to +125 ℃ |
| Temperature coefficient |
0 ±30 ppm/℃ |
High Temperature Loading
(% Rated Voltage) |
200 % |
| Insulation Resistance (min) |
10 GΩ |
| Derating |
STD |
| Dimension L |
0.25 ±0.013 mm |
| Dimension W |
0.125 ±0.013 mm |
| Dimension T |
0.125 ±0.013 mm |
| Dimension e |
0.0675 ±0.0275 mm |
| RoHS Compliance (10 subst.) |
Yes |
| REACH Compliance (247 subst.) |
Yes |
| Halogen Free |
Yes |
| Soldering |
Reflow |
| Standard Quantity |
Taping Embossed 50000pcs |
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外观
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高性能建议
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特征
Improved higher density mounting
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
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主要用途
General electronic equipment
Communication equipment
(cellular phone, wireless applications, etc.)
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产品資料
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模拟数据
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链接
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关于产品的环保证明书
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特徵值圖
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Sn-Zn solder paste can affect MLCC reliability performance.
Please contact Taiyo Yuden Co., Ltd prior to usage.
Please contact our sales staff when ordering or inquiring the details about products on our website.
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