Specifications
Status |
Non-preferred |
Capacitance |
1 uF ± 10 % |
Case Size (EIA/JIS) |
0805/2012 |
Rated Voltage |
25 V |
tanδ (max) |
3.5 % |
Temperature Characteristic (EIA) |
X7R |
Operating Temp. Range (EIA) |
-55 to +125 ℃ |
High Temperature Loading (% Rated Voltage) |
150 % |
Insulation Resistance (min) |
500 MΩ·μF |
Dimension L |
2.0 ±0.10 mm |
Dimension W |
1.25 ±0.10 mm |
Dimension T |
1.25 ±0.10 mm |
Dimension e |
0.50 ±0.25 mm |
RoHS Compliance (10 subst.) |
Yes |
REACH Compliance (240 subst.) |
Yes |
IEC62474 (Ver. D28.00) Compliance |
Yes |
Halogen Free |
Yes |
Soldering |
Reflow/Wave |
Standard Quantity |
Taping Embossed 3000pcs |
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Appearance
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Features
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
The use of nickel as electrode material and plating processing improve the solderability and heat resistance characteristics. It also prevents migration and raises the level of reliability.
Low equivalent series resistance(ESR) provides superior noise absorption characteristics
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Main Applications
Communication equipment (cellular phone, wireless applications, etc.)
General digital circuit
Power supply bypass capacitors Liquid crystal modules Liquid crystal drive voltage lines LSI, IC, converters (both for input and output)
Smoothing capacitors DC-DC converters (for both input and output) Switching power supplies (secondary side)
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Document
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Simulation data
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Links
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RoHS and REACH Certificate of Compliance
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Characteristic value graphs
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Sn-Zn solder paste can affect MLCC reliability performance. Please contact Taiyo Yuden Co., Ltd prior to usage.
Please contact our sales staff when ordering or inquiring the details about products on our website.
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