CERAMIC RF DEVICES  [Ceramic RF Devices (Low Pass Type)]

Specifications

Status Mass Production (Preferred)
System W-CDMA/CDMA/GSM/LTE
Passband Frequency1 (f1) 470 to 787 MHz
Insertion Loss1 (max)(in f1) 0.5 dB at 470 to 787MHz (+25 ℃)
Insertion Loss2 (max)(in f1) 0.6 dB at 470 to 787MHz (-40 to +85 ℃)
VSWR1 (max)(in f1) 2 at 470 to 787MHz
Attenuation1 (min)(f1) 26 dB at 1429 to 1501MHz
Attenuation2 (min)(f1) 30 dB at 1565 to 1607MHz
Attenuation3 (min)(f1) 35 dB at 1570 to 1580MHz
Attenuation4 (min)(f1) 18 dB at 1920 to 1980MHz
Input Impedance 50 Ω
Output Impedance 50 Ω
Dimension L 1.6 ±0.10 mm
Dimension W 0.8 ±0.10 mm
Dimension T Max 0.65 mm
Operating Temp. Range -40 to +85 ℃
RoHS Compliance (10 subst.) Yes
REACH Compliance (240 subst.) Yes
IEC62474 (Ver. D28.00) Compliance Yes
Halogen Free Yes
Soldering Reflow
Standard Quantity Taping Paper 4000pcs

Appearance

Features

Compact and Low-profile

Low loss and high attenuation

Stable temperature characteristics

Document

 

Simulation data

Links

 

RoHS and REACH Certificate of Compliance

Characteristic value graphs

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