Specifications
| Status |
Non-preferred |
| Capacitance |
7.9 pF ± 0.1pF |
| Case Size (EIA/JIS) |
0201/0603 |
| Rated Voltage |
50 V |
| Q (min) |
558 at 1MHz |
| Temperature Characteristic (EIA) |
C0G |
| Operating Temp. Range (EIA) |
-55 to +125 ℃ |
| Temperature Characteristic (JIS) |
CG |
| Operating Temp. Range (JIS) |
-55 to +125 ℃ |
| Temperature coefficient |
0 ±30 ppm/℃ |
High Temperature Loading
(% Rated Voltage) |
200 % |
| Insulation Resistance (min) |
10 GΩ |
| Dimension L |
0.6 ±0.03 mm |
| Dimension W |
0.3 ±0.03 mm |
| Dimension T |
0.3 ±0.03 mm |
| Dimension e |
0.15 ±0.05 mm |
| RoHS Compliance (10 subst.) |
Yes |
| REACH Compliance (242 subst.) |
Yes |
| IEC62474 (Ver. D29.00) Compliance |
Yes |
| Halogen Free |
Yes |
| Soldering |
Reflow |
| Standard Quantity |
Taping Paper 15000pcs |
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Appearance
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Features
Improved higher density mounting
Monolithic structure provides higher reliability
A wide range of capacitance values available in standard case sizes
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Main Applications
General electronic equipment
Communication equipment
(cellular phone, wireless applications, etc.)
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Document
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Simulation data
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Links
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RoHS and REACH Certificate of Compliance
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Characteristic value graphs
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Sn-Zn solder paste can affect MLCC reliability performance.
Please contact Taiyo Yuden Co., Ltd prior to usage.
Please contact our sales staff when ordering or inquiring the details about products on our website.
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