TSC1N18D1G68NC0AAT

(Previous Part Number FI168K1687AA-T)

CERAMIC RF DEVICES

[Ceramic RF Devices (Coupler)]


Appearance

Specifications

Status Mass Production (Preferred)
System W-CDMA/CDMA/GSM/LTE
/ISM900/Bluetooth/Wi-Fi
Passband Frequency1 (f1) 698 to 2690 MHz
Insertion Loss1 (max)(in f1) 0.25 dB at 698 to 2690MHz (+25 ℃)
Insertion Loss2 (max)(in f1) 0.3 dB at 698 to 2690MHz (-40 to +85 ℃)
VSWR1 (max)(in f1) 1.67 at 698 to 2690MHz
RFCoupling1 (min)(max)(in f1) 21.5dB (min) 29dB (max) at 698 to 2690MHz
Isolation1 (min) 35 dB at 698 to 2690MHz
Input Impedance / Output Impedance 50 Ω / 50 Ω
Dimension L 1.6 ±0.10 mm
Dimension W 0.8 ±0.10 mm
Dimension T Max 0.65 mm
Operating Temp. Range -40 to +85 ℃
RoHS Compliance (10 subst.) Yes
REACH Compliance (240 subst.) Yes
IEC62474 (Ver. D28.00) Compliance Yes
Halogen Free Yes
Soldering Reflow
Standard Quantity Taping Paper 8000pcs
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Features

Compact and Low-profile

Low loss and high attenuation

Stable temperature characteristics

Document

Links

RoHS and REACH Certificate of Compliance

Characteristic value graphs

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