(Previous Part Number FI212P1955EN-T)
CERAMIC RF DEVICES
[Ceramic RF Devices (Diplexers)for 5G]
| Status | Mass Production (Preferred) |
|---|---|
| System | LTE/5G |
| Frequency1 | Low band |
| Passband Frequency1 (f1) | 617 to 2200 MHz |
| Insertion Loss1 (max)(in f1) | 1.75 dB at 617 to 2200MHz ( ℃) |
| Insertion Loss2 (max)(in f1) | 1.9 dB at 617 to 2200MHz (-40 to +85 ℃) |
| VSWR1 (max)(in f1) | 2 at 617 to 2200MHz |
| Attenuation1 (min)(f1) | 16 dB at 2496 to 2690MHz |
| Attenuation2 (min)(f1) | 17 dB at 3300 to 5000MHz |
| Frequency2 | High band |
| Passband Frequency2 (f2) | 2496 to 5000 MHz |
| Insertion Loss1 (max)(in f2) | 1.55 dB at 2496 to 5000MHz ( ℃) |
| Insertion Loss2 (max)(in f2) | 1.7 dB at 2496 to 5000MHz (-40 to +85 ℃) |
| VSWR1 (max)(in f2) | 2 at 2496 to 5000 |
| Attenuation1 (min)(f2) | 14 dB at 1427 to 1710MHz |
| Attenuation2 (min)(f2) | 17 dB at 1710 to 2200MHz |
| Input Impedance / Output Impedance | 50 Ω / 50 Ω |
| Dimension L | 2.0 ±0.15 mm |
| Dimension W | 1.25 ±0.15 mm |
| Dimension T | Max 1.0 mm |
| Operating Temp. Range | -40 to +85 ℃ |
| RoHS Compliance (10 subst.) | Yes |
| REACH Compliance (251 subst.) | Yes |
| Halogen Free | Yes |
| Soldering | Reflow |
| Standard Quantity | Taping Embossed 3000pcs |