CERAMIC RF DEVICES
[Ceramic RF Devices (Diplexers)for 5G for General Purpose]
| Status | Mass Production (Preferred) |
|---|---|
| System | 5G/UWB |
| Frequency1 | Low band |
| Passband Frequency1 (f1) | 1400 to 5000 MHz |
| Insertion Loss1 (max)(in f1) | 1.2 dB at 1400 to 5000MHz (+25 ℃) |
| Insertion Loss2 (max)(in f1) | 1.3 dB at 1400 to 5000MHz (-40 to +85 ℃) |
| VSWR1 (max)(in f1) | 2 at 1400 to 5000MHz |
| Attenuation1 (min)(f1) | 20 dB 6240 to 8250MHz |
| Frequency2 | High band |
| Passband Frequency2 (f2) | 6240 to 8250 MHz |
| Insertion Loss1 (max)(in f2) | 1.1 dB at 6240 to 8250MHz (+25 ℃) |
| Insertion Loss2 (max)(in f2) | 1.2 dB at 6240 to 8250MHz (-40 to +85 ℃) |
| VSWR1 (max)(in f2) | 2 at 6240 to 8250 MHz |
| Attenuation1 (min)(f2) | 30 dB at 1400 to 2690MHz |
| Attenuation2 (min)(f2) | 20 dB at 3300 to 5000MHz |
| Input Impedance / Output Impedance | 50 Ω / 50 Ω |
| Dimension L | 2.0 ±0.15 mm |
| Dimension W | 1.25 ±0.15 mm |
| Dimension T | Max 0.7 mm |
| Operating Temp. Range | -40 to +85 ℃ |
| RoHS Compliance (10 subst.) | Yes |
| REACH Compliance (253 subst.) | Yes |
| Halogen Free | Yes |
| Soldering | Reflow |
| Standard Quantity | Taping Embossed 5000pcs |